Period：June 26(Wed)-28(Fri), 2024
Venue：Tokyo Big Site
SUSUMU participated in COMNEXT, an international exhibition showcasing the next generation of communication technologies, including 6G. During the event, we engaged with over 120 industry professionals, identifying new demands and forging valuable connections. Our booth exhibited nine series of high-frequency chip components, such as attenuators and terminators, highlighting our latest products: the RFD series, ATF series, and ATS-FD series.
